Nano Tin bismuth (Sn-Bi ) ingxubevange engumgubo / iBismuth Tin ingxubevange engumgubo

Inkcazelo emfutshane:

Igama leMveliso: I-tin bismuth alloy powder

Ifomula: Sn42Bi58

Ubunyulu: 99.5% 99.8%

Ubungakanani besuntswana: 50nm, 200-300nm, 500nm, 325mesh, njl.

Imbonakalo: Umgubo omnyama

Uphawu: Epoch-Chem

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Iinkcukacha zeMveliso

Iithegi zeMveliso

Ingcaciso yeMveliso

Intshayelelo emfutshane

Igama leMveliso: I-tin bismuth alloy powder

Ifomula: Sn42Bi58

Ubunyulu: 99.5% 99.8%

Ubungakanani besuntswana: 50nm, 200-300nm, 500nm, 325mesh, njl.

Imbonakalo: Umgubo omnyama

Uphawu: Epoch-Chem

Nano Tin bismuth alloy powder / Sn-Bi ingxubevange engumgubo SnBi umgubo Sn42Bi58

	Umzekelo	APS(nm)	Ucoceko(%)	Indawo ethile yomphezulu (m2/g)	Ubuninzi bomthamo (g/cm3)	Ifom yeCrystal	Umbala
Nano	Sn42Bi58	50	>99.8	13.46	0.64	ngqukuva	Mnyama
I-sub-micron	Sn42Bi58	500	>99.5	1.245	1.56	ngqukuva	Mnyama

Inkcazo

Igama lemveliso:	I-Tin Bismuth Alloy Powder (umgubo we-SnBi)
Umgangatho	99% min	Ubuninzi:	500kg
Inombolo yebhetshi.	2021081208	Ubungakanani besuntswana	200-300nm
Umhla wokwenziwa:	Ngo-Agasti 12, 2021	Umhla wovavanyo:	Ngo-Agasti 12, 2021
Iiparamitha	Inkcazo	Iziphumo
Ubunyulu	≥99%	>99.5%
Sn	≥41.8%	41.87%
Pb	≤0.003%	0.0014
Sb	≤0.005%	0.003%
Cu	≤0.001%	0.0002%
Zn	≤0.001%	0.0003%
Ag	≤0.001%	0.0007%
Al	≤0.001%	0.0001%
As	≤0.005%	0.0025%
Cr	≤0.001%	0.0006%
Fe	≤0.0005%	0.0001%
Ge	≤0.005%	0.0046%
Ni	≤0.0005%	0.0003%
Bi	Ibhalansi	ukuhambelana
Ubungakanani beNceba (D50)	200-300nm
Uphawu	Epoch-Chem

Isicelo

1. Phakathi kwezinto eziphathekayo ze-semiconductor, i-low-melting tin-bismuth alloy alloy inamandla aphantsi, ngoko akulula ukubangela iziphene ezifana neentlobo kunye nemikrwelo ngexesha lenkqubo ye-stamping, enenzuzo ekuphuculeni umgangatho weendawo ezigxininisiweyo.

2. Izongezo zezixhobo ze-alloy kunye ne-powder metallurgy materials, ukucoca iinkozo, ukusabalalisa kunye nokuqinisa, kunye nokutshintsha iimpawu zomatshini zezinto.